Silver Sintering Technology

Silver sintering is an advanced die-attach technology that uses silver film or silver paste as an intermediate bonding material. Under controlled temperature, pressure, and time conditions, it forms a metallurgical bond between the chip and the substrate through solid-state diffusion or liquid-phase sintering.

Compared with conventional soldering technologies, silver sintering offers a higher melting point, lower electrical resistivity, better thermal stability, and excellent thermal conductivity.

AQG-324 automotive reliability qualified module

DIODSENT modules have been qualified in accordance with AQG-324 automotive reliability requirements. The qualification items cover power cycling, environmental stress, and key electrical tests to evaluate the long-term reliability of the module package structure, silver sintering interconnection technology, and assembly process under automotive application conditions.

Products qualified in accordance with AQG 324 provide customers with stronger reliability references for adoption in new energy vehicles, industrial drives, and high-reliability power conversion applications. Relevant test reports can be provided upon request based on customer project requirements.

Fully Automated Final Test System for Static and Dynamic Testing

-Data obtained through double-pulse measurement will fall within the allowable accuracy range.
-Measurement data generated by the equipment shall not be used as product specifications.
-All values generated from the testing process are typical data and will be reflected in the product data sheets.
-If the static test conditions are adjusted, the values shown in the data sheet will change accordingly.
-The final test conditions for mass production will be determined based on the preferences of the end customer’s engineering team.